Jiangsu, China

Xuwen Jing

This inventor holds 1 USPTO granted patent. Top assignee: Jiangsu University of Science and Technology. Active years: 2026.


% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xuwen Jing: Innovator in Ship Construction Technology

Introduction

Xuwen Jing is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of ship construction technology. His innovative approach addresses challenges faced in the segmental construction of ships.

Latest Patents

Xuwen Jing holds a patent for a "Dynamic compensation method for curved surface deformation in ship segmental construction." This method involves fitting a curved surface and building a segmental deformation compensation model based on the actual segmentation of a ship. The goal is to obtain a theoretical height of a jig frame. The process includes establishing a correlation between jig frames based on the ship's segmental deformation range and the compression load. The method allows for segmental deformation compensation by adopting a preset adaptive regulation and control algorithm of jig frame height. This innovative compensation method establishes a correlation between a reference jig frame and slave jig frames of each level.

Career Highlights

Xuwen Jing is affiliated with Jiangsu University of Science and Technology, where he contributes to research and development in ship construction technologies. His work has garnered attention for its practical applications in the industry.

Collaborations

Xuwen Jing collaborates with esteemed colleagues, including Jinfeng Liu and Honggen Zhou. Their combined expertise enhances the research and development efforts in their field.

Conclusion

Xuwen Jing's innovative contributions to ship construction technology demonstrate his commitment to advancing the industry. His patent on dynamic compensation methods showcases his ability to solve complex engineering challenges.

Profile summary based on public USPTO records.
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