Xuepeng Gao

Title: Xuepeng Gao: Innovator in Metal Plating Technology

Introduction

Xuepeng Gao is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor materials, particularly in metal plating compositions. His innovative work has garnered attention for its industrial application value.

Latest Patents

Xuepeng Gao holds a patent for a leveling agent and a metal plating composition containing the same. The patent, titled "Leveling agent, metal plating composition containing same, preparation method therefor and use thereof," discloses a unique formulation that includes a metal plating solution comprising a copper salt, an acidic electrolyte, a source of halide ions, and water. The leveling agent is a compound of formula I. This composition is particularly useful in the processes of printed circuit board electroplating and integrated circuit copper interconnection electroplating. It achieves remarkable results, including no voids or defects, low purity in the plating layer, good plating homogeneity, a dense structure, and small surface roughness.

Career Highlights

Xuepeng Gao is currently employed at Shanghai Sinyang Semiconductor Materials Co., Ltd. His work at this company has allowed him to focus on developing advanced materials for the semiconductor industry. His innovative approaches have positioned him as a key player in the field.

Collaborations

Xuepeng Gao collaborates with talented individuals such as Su Wang and Liqi Shi. Their combined expertise contributes to the advancement of semiconductor materials and technologies.

Conclusion

Xuepeng Gao's contributions to metal plating technology demonstrate his commitment to innovation and excellence in the semiconductor industry. His patent reflects a significant advancement that holds promise for future applications.