Beijing, China

Xue Meng

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignees: Boe Technology Group Co., Ltd., Chengdu Boe Optoelectronics Technology Co., Ltd.. Active years: 2024.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Xue Meng - Innovator in Flexible Panel Bonding Technology

Introduction

Xue Meng is a notable inventor based in Beijing, China. He has made significant contributions to the field of flexible panel technology, particularly through his innovative bonding methods. His work has implications for various applications in electronics and display technologies.

Latest Patents

Xue Meng holds a patent for a "Bonding method and bonding device for flexible panel." This invention utilizes a heated-type optical adhesive that exhibits low viscosity at normal temperatures. The adhesive allows for effective separation before bonding, which helps to avoid poor bonding in bending regions and minimizes the risk of bubbles and cracks. The increased viscosity of the adhesive upon heating ensures a strong bond between the flexible panel and the protective cover plate.

Career Highlights

Throughout his career, Xue Meng has worked with prominent companies in the technology sector. He has been associated with Chengdu Boe Optoelectronics Technology Co., Ltd. and Boe Technology Group Co., Ltd. His experience in these organizations has contributed to his expertise in flexible panel technologies.

Collaborations

Xue Meng has collaborated with several professionals in his field, including Jialin Wang and Chaoxue Qin. These collaborations have likely enriched his research and development efforts, leading to advancements in bonding technologies.

Conclusion

Xue Meng's innovative work in bonding methods for flexible panels showcases his expertise and commitment to advancing technology. His contributions are valuable to the electronics industry and highlight the importance of effective bonding solutions.

Profile summary based on public USPTO records.
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