Jiangsu, China

Xiongfei Wen

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Makita Corporation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiongfei Wen. Retrieved from https://idiyas.com/inventor/xiongfei-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Xiongfei Wen: Innovator in Thickness Planing Technology

Introduction

Xiongfei Wen is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of thickness planing technology, holding a total of 2 patents. His innovative designs have the potential to enhance efficiency and functionality in woodworking applications.

Latest Patents

Wen's latest patents include a sophisticated thickness planer that features a housing, a motor, and a controller designed to optimize the driving of the motor. This thickness planer is equipped with at least one intake port and one outlet port, facilitating an efficient airflow passage that directs air from the intake to the outlet via the motor. Additionally, another thickness planer developed by Wen incorporates a motor, a planing part, a placing part, a feeding part, and a battery pack mounting unit. This design allows for a workpiece to be placed and fed into the planing part, powered by a detachable battery pack.

Career Highlights

Xiongfei Wen is currently employed at Makita Corporation, a company renowned for its high-quality power tools and equipment. His work at Makita has allowed him to focus on developing innovative solutions that meet the needs of the woodworking industry.

Collaborations

Wen collaborates with talented coworkers, including Shixuan Peng and Zuoxiu Zhao, who contribute to the development of advanced technologies in their field.

Conclusion

Xiongfei Wen's contributions to thickness planing technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of engineering principles and a dedication to improving woodworking processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…