Taipei, Taiwan

Xiong Zhang


Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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2 patents (USPTO):Explore Patents

Title: Xiong Zhang: Innovator in Heat Dissipation Technology

Introduction

Xiong Zhang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding 2 patents that showcase his innovative designs and engineering skills. His work is particularly relevant in industries where efficient thermal management is crucial.

Latest Patents

Xiong Zhang's latest patents include a "Heat dissipation device having irregular shape" and a "Double-sided roll bond condenser, double-sided roll bond condenser embedding structure, and embedding method thereof." The heat dissipation device features a first casing and a second casing, with the latter having a body that includes an inner surface and an outer surface. This design incorporates a plurality of columns on the inner surface and a first wick structure, enhancing its thermal performance. The double-sided roll bond condenser patent describes a main body with two filling structures protruding from its side surfaces, along with a U-shaped folded structure that improves its functionality.

Career Highlights

Xiong Zhang is currently employed at Cooler Master Co., Ltd., a company known for its innovative cooling solutions. His work at Cooler Master has allowed him to apply his expertise in thermal management and contribute to the development of advanced cooling products.

Collaborations

Xiong has collaborated with notable colleagues such as Jie Zhou and Xuemei Wang, further enhancing the innovative environment at Cooler Master. Their combined efforts have led to the successful development of cutting-edge technologies in heat dissipation.

Conclusion

Xiong Zhang's contributions to heat dissipation technology through his patents and work at Cooler Master Co., Ltd. highlight his role as a key innovator in the field. His designs not only improve thermal management but also pave the way for future advancements in cooling solutions.

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