Xinxin Liao

Title: Xinxin Liao: Innovator in Heat Dissipation Technology

Introduction

Xinxin Liao is a notable inventor based in Hefei, China. She has made significant contributions to the field of heat dissipation technology, particularly in the context of micro electronic components. Her innovative approach has led to the development of a unique heat dissipation apparatus that enhances the performance and reliability of electronic devices.

Latest Patents

Xinxin Liao holds a patent for a "Heat dissipation apparatus and communications device." This invention features a loop coil positioned on a swing plate, with magnets strategically placed on either side. When a current flows through the loop coil, it generates an Ampere force that causes the swing plate to oscillate. This mechanism effectively dissipates heat from micro electronic components, addressing a critical challenge in modern electronics.

Career Highlights

Throughout her career, Xinxin Liao has worked with prominent organizations, including Huawei Technologies Co., Limited and the University of Science and Technology of China. Her experience in these institutions has allowed her to refine her skills and contribute to cutting-edge research in her field.

Collaborations

Xinxin has collaborated with esteemed colleagues such as Zhihua Feng and Feng Zhang. These partnerships have fostered a dynamic exchange of ideas and have been instrumental in advancing her research endeavors.

Conclusion

Xinxin Liao's innovative work in heat dissipation technology exemplifies her commitment to enhancing electronic device performance. Her contributions are paving the way for future advancements in the field.