The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Nov. 02, 2018
Applicants:

Huawei Technologies Co., Ltd., Shenzhen, CN;

University of Science and Technology of China, Hefei, CN;

Inventors:

Zhihua Feng, Hefei, CN;

Liang Li, Shenzhen, CN;

Xinxin Liao, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 33/02 (2006.01); H05K 7/20 (2006.01); F04D 19/00 (2006.01); F04D 29/64 (2006.01); F04B 45/047 (2006.01); F04D 33/00 (2006.01); F04D 25/08 (2006.01); F04D 25/06 (2006.01);
U.S. Cl.
CPC ...
H02K 33/02 (2013.01); F04B 45/047 (2013.01); F04D 19/002 (2013.01); F04D 25/0606 (2013.01); F04D 25/08 (2013.01); F04D 29/646 (2013.01); F04D 33/00 (2013.01); H05K 7/20172 (2013.01);
Abstract

Embodiments of the present invention provide a heat dissipation apparatus. Wherein a loop coil is disposed on a swing plate. A first magnet and a second magnet are located on two sides of the loop coil, and when a current whose direction periodically varies flows through the loop coil, an Ampere force whose direction periodically varies is applied to the loop coil under an action of a magnetic field formed by the first magnet and the second magnet, so that the loop coil drives the swing plate to swing back and forth. The present invention is used for heat dissipation of a micro electronic component.


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