Xinwei Huang

Title: Innovations of Xinwei Huang in Crimping Technology

Introduction

Xinwei Huang is a notable inventor based in Beijing, China. He has made significant contributions to the field of crimping technology, particularly with his innovative external-leadwire crimping apparatus. His work has implications for the manufacturing of flexible printed circuit boards, which are essential in various electronic devices.

Latest Patents

Xinwei Huang holds 1 patent for his invention titled "External-leadwire crimping apparatus." This apparatus includes a heating base equipped with a heating rod and a temperature sensor. The crimping tool tip is connected to the heating base and is designed to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly. The process involves curing a conductive adhesive after receiving heat. The crimping tool tip body features at least one heat dissipation slot and one heat dissipation hole, enhancing its functionality and efficiency.

Career Highlights

Throughout his career, Xinwei Huang has worked with prominent companies in the technology sector. He has been associated with BOE Technology Group Co., Ltd. and Hefei Xinsheng Optoelectronics Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic manufacturing.

Collaborations

Xinwei Huang has collaborated with several professionals in his field, including Yusheng Ke and Yanping Li. These collaborations have fostered innovation and have been instrumental in the development of his patented technology.

Conclusion

Xinwei Huang's contributions to crimping technology exemplify the importance of innovation in the electronics industry. His patent for the external-leadwire crimping apparatus showcases his ability to address practical challenges in manufacturing. His work continues to influence the development of flexible printed circuit boards and their applications in modern technology.