The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Aug. 11, 2016
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
Yusheng Ke, Beijing, CN;
Yanping Li, Beijing, CN;
Jiali Wang, Beijing, CN;
Junjun Liu, Beijing, CN;
Yun Wang, Beijing, CN;
Xinwei Huang, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Anhui, CN;
Abstract
An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof.