Junjun Liu

Title: Junjun Liu - Innovator in Crimping Technology

Introduction

Junjun Liu is a notable inventor based in Beijing, China. He has made significant contributions to the field of crimping technology, particularly with his innovative external-leadwire crimping apparatus. His work has implications for the manufacturing of flexible printed circuit boards, which are essential in various electronic devices.

Latest Patents

Junjun Liu holds 1 patent for his invention titled "External-leadwire crimping apparatus." This apparatus includes a heating base equipped with a heating rod and a temperature sensor. The crimping tool tip is connected to the heating base and is designed to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly. The process involves curing a conductive adhesive after receiving heat. The crimping tool tip body features at least one heat dissipation slot and one heat dissipation hole, enhancing its functionality and efficiency.

Career Highlights

Throughout his career, Junjun Liu has worked with prominent companies in the technology sector. He has been associated with BOE Technology Group Co., Ltd. and Hefei Xinsheng Optoelectronics Technology Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electronics and manufacturing.

Collaborations

Junjun Liu has collaborated with several professionals in his field. Notable coworkers include Yusheng Ke and Yanping Li, who have contributed to various projects alongside him.

Conclusion

Junjun Liu's innovative work in crimping technology showcases his dedication to advancing electronic manufacturing processes. His patent for the external-leadwire crimping apparatus highlights his ability to solve complex engineering challenges. His contributions are valuable to the industry and reflect his commitment to innovation.