Xinman Mo

Title: Xinman Mo and a Heat-Dissipating Rigid-Flex Circuit Board

Introduction

Xinman Mo is an inventor associated with Guangdong, China. His work includes a patent for a metal-based sandwich rigid-flex circuit board designed to manage heat in electronic assemblies.

Latest Patents

Mo is named on 1 patent: “Preparation Method of a Boss-Type Metal-Based Sandwich Rigid-Flex Circuit Board.” The patent describes a board built from rigid and flexible sub-plates, dielectric layers, and a metal core. Metal bosses and heat-dissipation areas are arranged on the core, with corresponding window areas in the board layers.

The metal bosses provide a thermal path for locally heating electronic components, while the metal core and heat-dissipation areas help manage heat from high-density wiring. The design aims to support reliable heat dissipation across both localized components and the broader circuit board.

Career Highlights

Mo has been associated with Shenzhen Fastprint Circuit Tech Co., Ltd. and Guangzhou Fastprint Circuit Tech Co., Ltd. His patent reflects work on circuit-board construction and thermal management.

Collaborations

Bei Chen and Bo Xu are identified as Mo’s coworkers. The available information does not specify their roles in the patent or the development of the circuit-board design.

Conclusion

Xinman Mo’s documented patent focuses on integrating rigid-flex circuit-board construction with a metal-core heat-dissipation design for electronic components and high-density wiring.