Tianjin, China

Xinglei Cheng

This inventor holds 1 USPTO granted patent. Top assignee: East China Jiaotong University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xinglei Cheng. Retrieved from https://idiyas.com/inventor/xinglei-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xinglei Cheng: Innovator in Suction Penetration Technology

Introduction

Xinglei Cheng is a notable inventor based in Tianjin, China. He has made significant contributions to the field of engineering, particularly in the development of devices that enhance the understanding of suction penetration processes.

Latest Patents

Xinglei Cheng holds a patent for a "Device for simulating suction penetration of suction caisson based on centrifuge model test." This innovative device includes a model box, a suction caisson model, and a penetration device that is designed to dynamically correct displacement deviation during the suction penetration process. The device allows for continuous testing in a centrifugal state, which is crucial for accurate simulations.

Career Highlights

Cheng is affiliated with East China Jiaotong University, where he contributes to research and development in engineering. His work focuses on improving the methodologies used in suction penetration testing, which is vital for various engineering applications.

Collaborations

Xinglei Cheng has collaborated with notable colleagues such as Wenbo Tu and Changjie Xu. Their combined expertise enhances the research output and innovation potential within their projects.

Conclusion

Xinglei Cheng's contributions to suction penetration technology exemplify the importance of innovation in engineering. His patent and ongoing research efforts continue to advance the field, making significant impacts on engineering practices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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