Company Filing History:
Years Active: 2014
Title: **Xing-Hua He: Innovator in Heat Dissipation Technology**
Introduction
Xing-Hua He is a notable inventor based in Shenzhen, China, recognized for his contributions to heat dissipation technology. With a total of two patents to his name, his innovative designs reflect a deep understanding of thermal management systems.
Latest Patents
Among his recent patents, the first is a **Heat Dissipation Apparatus with Heat Pipe**. This innovative apparatus features multiple fins and a heat pipe. Each fin is designed with a through hole and includes a collar that inclines toward the center, allowing the heat pipe to expand and provide effective thermal contact. The unique design ensures that the collar naturally accommodates the heat pipe, promoting efficient heat transfer.
His second patent, titled **Method for Manufacturing Heat Dissipating Apparatus**, details a streamlined approach to create a heat dissipation apparatus. The process includes assembling a stack of fins, each fitted with collars at their edges. By using two opposing punching tools, the collars are pressed inward to securely fit the heat pipe, thereby optimizing the manufacturing process and enhancing the performance of the final apparatus.
Career Highlights
Xing-Hua He has built his career at leading technology companies, including Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. Here, he honed his skills and further contributed to advancements in heat dissipation technologies.
Collaborations
Throughout his career, Xing-Hua He has collaborated with talented colleagues, including Chun-Chi Chen and Jing Zhang. These partnerships have fostered a creativity-driven environment that has supported the development of innovative solutions in thermal management.
Conclusion
Xing-Hua He stands out as an influential inventor whose work significantly advances the field of heat dissipation technology. His patents reflect a commitment to innovation and efficiency, solidifying his reputation as a key player in the industry. With continued collaboration and research, he is poised to contribute even further to advancements in this crucial area of technology.