Xin-Wei Lo

Title: Innovations by Inventor Xin-Wei Lo

Introduction

Xin-Wei Lo is a notable inventor based in Pingtung County, Taiwan. He has made significant contributions to the field of electroplating and chip packaging technologies. With a total of 2 patents, his work demonstrates a commitment to enhancing manufacturing processes and product reliability.

Latest Patents

One of Xin-Wei Lo's latest patents is an electroplating system designed for depositing a plating material on an object. This system includes a pressure device and an anode element. The pressure device features a lid with first and second through holes, along with a base that contains a chamber, conduction holes, and third through holes. The design allows for the spraying of an electroplating solution toward the object while preventing defective plating and enhancing plating efficiency.

Another significant patent is a chip package that incorporates a flexible substrate. This package includes a chip, a pressure-proof member, and a reinforcement sheet. The pressure-proof member features a pair of pressure-proof ribs that protect the chip from damage caused by external pressure. This innovative design ensures the durability and reliability of the chip package.

Career Highlights

Xin-Wei Lo is currently employed at Chipbond Technology Corporation, where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of electroplating and chip packaging, making him a valuable asset to his company.

Collaborations

Xin-Wei Lo collaborates with talented individuals such as Nian-Cih Yang and Cheng-Hung Shih. Their combined expertise contributes to the innovative projects at Chipbond Technology Corporation.

Conclusion

Xin-Wei Lo's contributions to the fields of electroplating and chip packaging highlight his innovative spirit and dedication to improving technology. His patents reflect a deep understanding of manufacturing processes and a commitment to enhancing product quality.