Xin-Lei Liu

Title: Innovations by Inventor Xin-Lei Liu

Introduction

Xin-Lei Liu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of heat dissipation technology, holding a total of 2 patents. His work focuses on improving the efficiency of electronic components through innovative designs.

Latest Patents

Xin-Lei Liu's latest patents include a heat dissipation device designed for electronic components mounted on printed circuit boards. The first patent describes a device that features a fin unit, a heat-conducting board attached to the electronic component, and a heat pipe that thermally connects the fin unit and the heat-conducting board. This design includes a clip that secures the heat pipe to the top face of the heat-conducting board, ensuring effective heat management. The second patent also pertains to a heat dissipation device, which incorporates a centrifugal fan adjacent to the fin unit. This device features an engaging portion that allows the heat pipe to be fixed to the heat-conducting board, enhancing the overall thermal performance of the electronic component.

Career Highlights

Throughout his career, Xin-Lei Liu has worked with prominent companies in the technology sector. He has been associated with Fu Zhun Precision Industry Co., Ltd. and Foxconn Technology Co., Ltd. These experiences have provided him with a solid foundation in the development of innovative electronic solutions.

Collaborations

Xin-Lei Liu has collaborated with talented individuals in his field, including Chun-Chi Chen and Hong-Cheng Yang. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Xin-Lei Liu's contributions to heat dissipation technology demonstrate his innovative spirit and commitment to enhancing electronic component performance. His patents reflect a deep understanding of thermal management, making him a valuable figure in the field of electronics.