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Years Active: 2018-2024
Title: Xikun Zhang: Innovator in Semiconductor Technology
Introduction
Xikun Zhang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on multi-die packages that enhance the performance and efficiency of semiconductor devices.
Latest Patents
One of Xikun Zhang's latest patents is a package with different types of semiconductor dies attached to a flange. This multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the flange via a first die attach material. Additionally, a second semiconductor die is attached to the same thermally conductive flange as the first semiconductor die via a second die attach material. The leads are configured to provide external electrical access to both semiconductor dies, with the second semiconductor die made of a different material than the first. This innovative design allows for improved thermal management and electrical performance.
Career Highlights
Throughout his career, Xikun Zhang has worked with leading companies in the semiconductor industry. Notably, he has been associated with Infineon Technologies AG and Macom Technology Solutions Holdings, Inc. His experience in these organizations has contributed to his expertise in semiconductor packaging and technology.
Collaborations
Xikun Zhang has collaborated with notable professionals in the field, including Bill Agar and Dejiang Chang. These collaborations have further enriched his work and contributed to advancements in semiconductor technology.
Conclusion
Xikun Zhang is a distinguished inventor whose work in semiconductor technology has led to innovative solutions in multi-die packaging. His contributions continue to influence the industry and pave the way for future advancements.