The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Jun. 01, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Yang Liu, Shanghai, CN;

Xikun Zhang, Shanghai, CN;

Bill Agar, Morgan Hill, CA (US);

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/047 (2006.01); H01L 23/66 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01P 3/08 (2006.01); H03F 3/193 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/047 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/585 (2013.01); H01L 25/072 (2013.01); H01P 3/081 (2013.01); H03F 3/193 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48195 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19032 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H03F 2200/165 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

A semiconductor package includes a metal flange having a lower surface and an upper surface opposite the lower surface. An electrically insulating window frame is disposed on the upper surface of the flange. The electrically insulating window frame forms a ring around a periphery of the metal flange so as to expose the upper surface of the metal flange in a central die attach region. A first electrically conductive lead is disposed on the electrically insulating window frame and extends away from a first side of the metal flange. A second electrically conductive lead is disposed on the electrically insulating window frame and extends away from a second side of the metal flange, the second side being opposite the first side. A first harmonic filtering feature is formed on a portion of the electrically insulating window frame and is electrically connected to the first electrically conductive lead.


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