Guangdong, China

Xichang He

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Hfc Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xichang He. Retrieved from https://idiyas.com/inventor/xichang-he-2npapplg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Xichang He: Innovator in Graphene Technology

Introduction

Xichang He is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of electronic product heat dissipation components. His innovative work focuses on the development of graphene thermally conductive gaskets, which are essential for improving the efficiency of electronic devices.

Latest Patents

Xichang He holds a patent for a "Graphene thermally conductive gasket edge-wrapped process and edge-wrapped graphene thermally conductive gasket." This invention relates to the methods used in creating effective heat dissipation components for electronic products. The process involves several steps, including coating adhesive on graphene films, stacking layers to achieve the desired height, and creating a gasket with specified thickness through precise slicing and edge-wrapping techniques.

Career Highlights

He is currently associated with Shenzhen HFC Co., Ltd., where he continues to innovate in the field of graphene technology. His work has garnered attention for its potential applications in various electronic devices, enhancing their performance and longevity.

Collaborations

Xichang He collaborates with notable colleagues, including Yong Cao and Aixiang Sun. Their combined expertise contributes to the advancement of graphene applications in technology.

Conclusion

Xichang He is a key figure in the development of graphene-based solutions for electronic heat dissipation. His innovative patent and ongoing work at Shenzhen HFC Co., Ltd. highlight his commitment to advancing technology in this critical area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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