Beijing, China

Xiaoyu Su

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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2 patents (USPTO):

Title: Innovations of Xiaoyu Su in 3D Model Editing

Introduction

Xiaoyu Su is a prominent inventor based in Beijing, China, known for his contributions to the field of 3D model editing. With a total of two patents to his name, he has developed innovative methods that enhance the efficiency and effectiveness of 3D modeling processes. His work is particularly relevant in the realms of computer-aided design and 3D model construction.

Latest Patents

Xiaoyu Su's latest patents include a "Line Guided Three-Dimensional Model Reshaping Method" and a "Structure Self-Adaptive 3D Model Editing Method." The first patent provides a method for reshaping 3D models by extracting contours from images and creating a 2D line database. This method allows for fewer user interactions while guiding the reshaping process, ultimately helping users design desirable 3D models with speed and ease. The second patent focuses on a self-adaptive editing method that clusters 3D models by structure and learns design knowledge to optimize model components automatically. This innovation enables users to edit fewer components while ensuring the overall model adheres to design standards.

Career Highlights

Xiaoyu Su is affiliated with Beihang University, where he contributes to research and development in 3D modeling technologies. His academic background and ongoing research efforts have positioned him as a key figure in advancing the capabilities of 3D model editing.

Collaborations

Xiaoyu Su collaborates with notable colleagues, including Xiaowu Chen and Qiang Fu, who contribute to his research endeavors and innovations in the field.

Conclusion

Xiaoyu Su's innovative patents and contributions to 3D model editing demonstrate his significant impact on the field. His work not only enhances the efficiency of design processes but also paves the way for future advancements in 3D modeling technologies.

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