Xiaoting Chang

Title: Innovations of Xiaoting Chang in Integrated Circuit Packaging

Introduction

Xiaoting Chang is a notable inventor based in Milpitas, CA, who has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents to his name, Chang's work focuses on enhancing the efficiency and functionality of packaged integrated circuits.

Latest Patents

One of Xiaoting Chang's latest patents is titled "Ball grid array package with laser vias and methods for making the same." This innovation involves a packaged integrated circuit (IC) that includes a die with bond pads, wire bonds contacting these pads, and a substrate designed to electrically connect the wire bonds to external package connectors. The substrate features mechanical vias through its layers and laser vias in the uppermost layer. Notably, each laser via is positioned closer to the die than the mechanical vias, ensuring they do not overlap or are covered by the die. The method outlined in the patent includes routing traces on both the uppermost and lowermost layers, forming mechanical vias through all substrate layers, and electrically connecting each wire bond to a trace on the uppermost substrate layer.

Career Highlights

Xiaoting Chang is currently employed at Marvell International Limited, where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Chang collaborates with talented individuals such as Chenglin Liu and Chender Chen, contributing to a dynamic team focused on cutting-edge technology in integrated circuit design.

Conclusion

Xiaoting Chang's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in modern electronics, paving the way for future advancements in the industry.