Shanghai, China

Xiaorui Yang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Diodes Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiaorui Yang. Retrieved from https://idiyas.com/inventor/xiaorui-yang-tco3czle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xiaorui Yang: Semiconductor Lead-Frame Inventor.

Introduction

Xiaorui Yang is an inventor based in Shanghai, China, associated with Diodes Incorporated. His patent work includes a semiconductor lead-frame design intended to support connections within a semiconductor device.

Latest Patents

The provided information lists one patent for Yang: “Lead Frame with a Tie Bar Having Branch Part.” The invention describes a semiconductor device with a chip attached to a base island and a connecting rib that extends obliquely from the island. A second part of the rib lies in a plane parallel to, but distinct from, the plane of the base island. A branch extending from that second part provides a surface for receiving a lead connected to the semiconductor chip, with the branch edge positioned at a specified distance from an edge of the base island. Yang is credited with 1 patent in the supplied data.

Career Highlights

Yang’s listed patent focuses on the structure and arrangement of a lead frame for a semiconductor device. The design specifies how the base island, connecting rib, and branch part are positioned relative to one another, including their planes and edge spacing. The supplied information associates Yang with Diodes Incorporated.

Collaborations

Wei Wu is identified as Yang’s coworker. The available information does not specify whether Wu collaborated with Yang on the listed patent.

Conclusion

Xiaorui Yang’s listed invention concerns a semiconductor lead frame with a branched connecting rib, reflecting a focus on component structure and electrical connections in semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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