Kyoto, Japan

Xiaopeng Wu

This inventor holds 4 USPTO granted patents. Top assignee: Rohm Co., Ltd.. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiaopeng Wu. Retrieved from https://idiyas.com/inventor/xiaopeng-wu-gqea8dfr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):Explore Patents

Title: Innovations of Xiaopeng Wu in Semiconductor Technology

Introduction

Xiaopeng Wu is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Wu's latest patents include innovative designs for semiconductor devices. One of his patents describes a semiconductor device that comprises an insulating layer, a semiconductor element, a wiring layer, and a sealing resin. This design features an insulating layer with obverse and reverse surfaces, along with a penetrated part extending in the thickness direction. The semiconductor element is in contact with the obverse surface and includes an electrode that corresponds to the penetrated part. The wiring layer consists of connecting and main parts, where the connecting part is located in the penetrated part and contacts the electrode. The sealing resin covers the semiconductor element and contacts the obverse surface. Notably, the electrode has a connecting surface that includes regions with varying surface roughness.

Another patent focuses on a semiconductor device that includes a supporting member, a conductive member, and a semiconductor element. The supporting member has a supporting surface facing in a thickness direction, while the conductive member is bonded to the supporting member. This device also features a first metal layer that covers part of the supporting surface and a second metal layer that covers the reverse surface, with both layers bonded through solid phase diffusion.

Career Highlights

Xiaopeng Wu is currently employed at Rohm Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Wu collaborates with fellow inventor Kazunori Fuji, contributing to the development of cutting-edge technologies in their field.

Conclusion

Xiaopeng Wu's contributions to semiconductor technology through his patents and work at Rohm Co., Ltd. highlight his role as a leading inventor in this critical area of innovation. His advancements are paving the way for future developments in semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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