Shanghai, China

Xiaoming Sui


Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2016-2021

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3 patents (USPTO):Explore Patents

Title: Innovations of Xiaoming Sui in Wafer Level Chip Scale Packaging

Introduction

Xiaoming Sui is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor packaging, particularly in wafer level chip scale packages (WLCSP). With a total of three patents to his name, Sui's work is recognized for its innovative approaches to enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

One of Xiaoming Sui's latest patents focuses on a wafer level chip scale package structure and its manufacturing method. This patent describes a WLCSP structure that includes a semiconductor die and a stack composed of a protective tape and a molding compound. A unique feature of this design is that a portion of the first interface surface between the molding compound and the protective tape is curved. The manufacturing method involves several steps, including forming a semiconductor structure, attaching it to a dummy wafer, and performing a two-step dicing process with different cutting tools. The curvature of the interface surface is specifically designed to reduce the likelihood of cracks forming in the WLCSP structure, thereby enhancing its durability.

Career Highlights

Xiaoming Sui is currently employed at Alpha and Omega Semiconductor (Cayman) Ltd., where he continues to innovate in the semiconductor industry. His expertise in WLCSP technology has positioned him as a key player in the development of advanced packaging solutions.

Collaborations

Sui collaborates with talented professionals in his field, including Cheow Khoon Oh and Ming-Chen Lu. These collaborations foster an environment of innovation and creativity, leading to advancements in semiconductor technology.

Conclusion

Xiaoming Sui's contributions to wafer level chip scale packaging demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the challenges in semiconductor manufacturing and offer practical solutions to enhance product reliability.

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