Alpha and Omega Semiconductor (cayman) Ltd.

Xiaoming Sui

Kai Chen

Ming-Chen Lu

Cheow Khoon Oh

Vincent Xue

Jun Lu

Yuping Gong

Yan Yun Xue

A wafer level chip scale package (WLCSP) structure and a manufacturing method are disclosed. The WLCSP structure comprises a semiconductor die and a stack. The stack comprises a protective tape and a molding compound. A portion of a first interface surface between the molding compound and the protective tape is curved. The manufacturing method comprises the steps of forming a semiconductor structure; attaching the semiconductor structure on a dummy wafer; performing a first dicing process using a first cutting tool; depositing a molding compound; removing the dummy wafer; performing a second dicing process with a second cutting tool. A first aperture of the first cutting tool is larger than a second aperture of the second cutting tool. The portion of the first interface surface being curved reduces the possibility of generation of cracks in the WLCSP structure.

Wafer level chip scale package structure and manufacturing method thereof

A dual-side exposed semiconductor package with ultra-thin die and a manufacturing method are disclosed. A die having a source electrode and a gate electrode at top surface is flipped and attached to a die paddle of a lead frame and then is encapsulated with a first molding compound. The first molding compound and the die are ground to reduce the thickness. A mask is applied atop the lead frame with the back of the flipped die exposed and a metal layer is deposited on the exposed area at the back of the flipped die. A metal clip is attached to the back of the flipped die. A second molding compound is deposited on the lead frame with the top surface of the metal clip exposed from the top surface of the second molding compound and the bottom surface of the lead frame exposed from the bottom surface of the second plastic molding compound.

Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereof

Growing community of inventors

Shanghai, China

Xiaoming Sui