This inventor holds 2 USPTO granted patents. Top assignee: Huawei Technologies Co., Limited. Active years: 2015-2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Shenzhen, CN (2015)
- Kiev, UA (2022)
Company Filing History:
Years Active: 2015-2022
Title: Innovations of Xiaohu Liu in Heat Dissipation Technologies
Introduction
Xiaohu Liu is a prominent inventor based in Kyiv, Ukraine, known for his contributions to heat dissipation technologies. He has been instrumental in developing innovative solutions that enhance the efficiency of electronic devices. With a total of 2 patents to his name, Liu's work is recognized in the field of thermal management.
Latest Patents
Liu's latest patents include a heat dissipation panel and a heat dissipation apparatus designed for electronic devices. The heat dissipation apparatus features a heat dissipation panel that incorporates a first heat conducting layer. This layer has a first surface exposed to the outside when bent, and a second surface opposite to it. The design allows for effective heat absorption from heat-emitting components, facilitating efficient heat conduction and dissipation.
Another significant patent involves an inverter, a sealing air duct, and a heat dissipation system. This invention includes an enclosure with two isolated cavities, a magnetic conversion circuit, and a power conversion circuit. The design also features a heatsink and a sealing air duct that ensures optimal airflow and heat management within the system.
Career Highlights
Xiaohu Liu is currently employed at Huawei Technologies Co., Limited, where he continues to innovate in the field of electronic device thermal management. His work at Huawei has allowed him to collaborate with leading experts in the industry, further enhancing his contributions to technology.
Collaborations
Liu has worked alongside notable colleagues such as Guo Yang and Quanming Li. Their collaborative efforts have led to advancements in heat dissipation technologies, showcasing the importance of teamwork in innovation.
Conclusion
Xiaohu Liu's contributions to heat dissipation technologies reflect his expertise and commitment to improving electronic device performance. His innovative patents and collaborations position him as a key figure in the field of thermal management.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile