Beijing, China

Xiaohong Lei

This inventor holds 1 USPTO granted patent. Top assignee: Beijing Grand Hitek. Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiaohong Lei. Retrieved from https://idiyas.com/inventor/xiaohong-lei

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xiaohong Lei: Inventor of an Improved-Capacity Vacuum Pump Assembly.

Introduction

Xiaohong Lei is an inventor based in Beijing, China, whose work includes a vacuum pump assembly designed to better manage process by-products. Her patent record includes 1 patent. She is associated with Beijing Grand Hitek Co., Ltd.

Latest Patents

Lei’s patent, “Vacuum Pump Assembly with Improved Process By-Product Holding Capacity,” describes an assembly with long and short rotors that turn in opposite directions on parallel shafts. Their multiple stages of rotor elements mesh correspondingly, while storage grooves are placed on non-critical surfaces of the rotor elements.

The grooves provide additional capacity for holding process by-products. The disclosed design aims to reduce pump jamming and wear caused by by-product adhesion.

Career Highlights

Lei’s documented patent work focuses on vacuum pump design and the handling of process by-products. The invention addresses equipment reliability by incorporating storage grooves into the rotor assembly.

Collaborations

Lei is associated with Beijing Grand Hitek Co., Ltd. Her listed coworkers include Min Wei and Xiaobo Lei.

Conclusion

Xiaohong Lei’s patented vacuum pump assembly uses rotor storage grooves to improve by-product handling and help prevent jamming and wear.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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