Xiaofeng Xu

Title: Innovations of Xiaofeng Xu in Semiconductor Packaging

Introduction

Xiaofeng Xu is a notable inventor based in Singapore, recognized for his contributions to semiconductor packaging technology. With a total of three patents to his name, he has made significant advancements in the field, particularly in the design and manufacturing of semiconductor packages.

Latest Patents

Xiaofeng Xu's latest patents include a heat-dissipating semiconductor package that features a plurality of metal pins situated between first and second encapsulation members. This innovative package structure comprises a first encapsulation member, a second encapsulation member, at least one semiconductor chip, and a second insulation layer. The first encapsulation member is designed with a first metal layer, a first insulation layer, and a second metal layer. The semiconductor chip is strategically placed between the two encapsulation members, with conductive terminals connected to the first metal layer or a third metal layer. The metal pins extend outward from the encapsulation members, while the second insulation layer secures the entire assembly, ensuring effective heat dissipation and structural integrity.

Another significant patent involves a package structure and its manufacturing method. This invention includes an insulation layer, an electronic component, and a lead frame unit. The electronic component is embedded within the insulation layer and features multiple conducting terminals. The lead frame unit, also embedded within the insulation layer, consists of a lead frame and a metallization layer. The metallization layer, which exceeds a thickness of 10 micrometers, is connected to at least one of the conducting terminals of the electronic component, enhancing the overall functionality of the package.

Career Highlights

Xiaofeng Xu is currently employed at Delta Electronics International (Singapore) Pte Ltd, where he continues to innovate in the semiconductor industry. His work focuses on developing advanced packaging solutions that improve the performance and reliability of electronic devices.

Collaborations

Xiaofeng has collaborated with notable colleagues, including Beng Beng Lim and Yiu Wai Lai, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Xiaofeng Xu's contributions to semiconductor packaging technology are noteworthy, with his patents reflecting a commitment to advancing the field. His work at Delta Electronics International continues to influence the industry positively.