Nagano, Japan

Xiao-Shan Ning


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1999-2001

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2 patents (USPTO):Explore Patents

Title: Innovations of Inventor Xiao-Shan Ning

Introduction

Xiao-Shan Ning is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of electronic circuit substrates, particularly through his innovative use of aluminum-ceramic composite materials. With a total of two patents to his name, Ning's work has the potential to revolutionize the manufacturing of electronic components.

Latest Patents

Ning's latest patents include an electronic circuit substrate fabricated from an aluminum ceramic composite material. This invention features an electronic circuit formed on an aluminum or aluminum alloy plate, which is prepared by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate. Another significant patent involves a process for preparing a ceramic electronic circuit board, where molten aluminum and a ceramic substrate are held in direct contact and then cooled to achieve a strong bond. This method allows for the consistent and cost-effective production of aluminum-ceramics composite substrates with excellent joint strength, thermal conductivity, and heat resistance characteristics.

Career Highlights

Xiao-Shan Ning is currently employed at Dowa Mining Co., Ltd., where he continues to develop innovative solutions in the field of electronic materials. His work has garnered attention for its practical applications and potential impact on the electronics industry.

Collaborations

Ning has collaborated with notable colleagues, including Choju Nagata and Masami Sakuraba, who contribute to the advancement of technology in their respective fields.

Conclusion

Xiao-Shan Ning's contributions to the field of electronic circuit substrates highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving manufacturing processes and enhancing the performance of electronic components.

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