Xiao-Peng Sun

Title: Innovations of Inventor Xiao-Peng Sun

Introduction

Xiao-Peng Sun is a notable inventor based in Fremont, CA. He has made significant contributions to the field of electronic modules and integrated circuits. With a total of 2 patents, his work showcases innovative approaches to electronic design and functionality.

Latest Patents

One of his latest patents is titled "Multi-layer interconnect module and method of interconnection." This electronic module features an interconnect module with multiple metal layers separated by dielectric layers. The design allows for electronic components to be mounted on one surface, with selective interconnections achieved through drilled via holes filled with conductive material. This method ensures that non-ground layers are effectively insulated from unintended connections to ground.

Another significant patent is the "MMIC power amplifier with wirebond output matching circuit." This hybrid microwave and millimeter wave integrated circuit (MMIC) RF power amplifier integrates an amplifier circuit with an output impedance matching network. The use of metal-insulator-metal (MIM) capacitors and bonding wire inductors results in a compact design, offering advantages over traditional power amplifiers that utilize planar transmission lines.

Career Highlights

Xiao-Peng Sun is currently employed at EIC Corporation, where he continues to innovate in the field of electronics. His work has been instrumental in advancing technologies that enhance the performance and efficiency of electronic devices.

Collaborations

He collaborates with talented coworkers, including Nanlei Larry Wang and Shuo-Yuan Hsiao, contributing to a dynamic and innovative work environment.

Conclusion

Xiao-Peng Sun's contributions to electronic module design and integrated circuits reflect his commitment to innovation. His patents demonstrate a forward-thinking approach that continues to influence the industry.