This inventor holds 1 USPTO granted patent and 2 EPO patents. Top assignees: Ningbo Sanhan Alloy Material Co., Ltd., Qingdao University of Technology. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Xianzhi Liu: Innovator in Packaging Technology
Introduction
Xianzhi Liu is a notable inventor based in Qingdao, China. He has made significant contributions to the field of packaging technology, particularly with his innovative designs and methods. His work focuses on enhancing the efficiency and effectiveness of packaging processes.
Latest Patents
Xianzhi Liu holds a patent for a "Width-adjustable packaging bag shaper, bag maker, packaging machine and method." This invention features a width-adjustable packaging bag shaper that includes a bag maker, a traction device, and a heat sealing device. These components are strategically arranged above the bag maker. The width adjustment device utilizes a leadscrew and slide block mechanism to modify the distances between different sub bottom plates, allowing for precise adjustments in the width of the bottom plate. This mechanism is crucial for achieving a three-dimensional shaping effect for various widths of packaging bags.
Career Highlights
Throughout his career, Xianzhi Liu has worked with reputable organizations, including Qingdao University of Technology and Ningbo Sanhan Alloy Material Co., Ltd. His experience in these institutions has contributed to his expertise in packaging technology and innovation.
Collaborations
Xianzhi Liu has collaborated with notable colleagues such as Changhe Li and Baoteng Huang. Their joint efforts have further advanced the field of packaging technology.
Conclusion
Xianzhi Liu's innovative contributions to packaging technology demonstrate his commitment to improving manufacturing processes. His patent for a width-adjustable packaging bag shaper highlights the importance of adaptability in packaging solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile