Tokyo, Japan

Xianyin Hu

This inventor holds 1 USPTO granted patent. Top assignees: Amada Gmbh, The University of Tokyo. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xianyin Hu. Retrieved from https://idiyas.com/inventor/xianyin-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xianyin Hu: Inventor of a Welding-System Innovation

Introduction

Xianyin Hu is an inventor associated with Tokyo, Japan. His patent work addresses how a welding system can use image-based position correction to guide welding operations. The available information lists 1 patent for Hu.

Latest Patents

Hu’s listed patent, “Work System and Welding System,” describes a system that moves a welding head to a designated position and performs a welding process according to an operation program. An imaging device captures the welding position and its surroundings. Image-processing software compares that image with a reference image, calculates a correction amount, and assesses confidence in the identified position. The system displays an image for confirmation, and a program-correction unit uses the correction amount and confidence level to adjust the operation program.

Career Highlights

Hu’s listed professional affiliations include AMADA GmbH and the University of Tokyo. These affiliations connect his profile with industrial and academic settings relevant to engineering and manufacturing.

Collaborations

Masashi Kaneko is identified as Hu’s coworker. The available information does not specify the details of their collaboration.

Conclusion

Xianyin Hu’s listed invention combines imaging, position assessment, and program correction to support welding operations, reflecting an approach to improving the accuracy and control of automated work systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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