Dongguan, China

Xiangqian Lu

This inventor holds 1 USPTO granted patent. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiangqian Lu. Retrieved from https://idiyas.com/inventor/xiangqian-lu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xiangqian Lu and Connector Technology

Introduction

Xiangqian Lu is an inventor associated with Dongguan, China, and Huawei Technologies Co., Ltd. His patent work includes a connector design intended to improve signal transmission and grounding performance.

Latest Patents

The provided information identifies one patent associated with Lu: “Connector, Connector Assembly, and Electronic Device.” The invention describes a ground conductive assembly with a conductive housing containing first and second cavities, along with a ground terminal that extends into the second cavity and connects electrically to its inner wall. At the opposite end, a lead frame carries signal terminal groups and shield layers on both sides. The design shortens the connector’s ground return path, which can improve transmission rates. The supplied data lists 1 patent.

Career Highlights

Lu’s listed patent reflects work on connector architecture for electronic devices, with attention to grounding, shielding, and high-speed signal transmission. The provided information associates him with Huawei Technologies Co., Ltd.

Collaborations

The supplied information names Kou Xu and Yaohua Tian as Lu’s coworkers. Their names are also associated with the collaborative context provided for his patent work.

Conclusion

Xiangqian Lu’s listed invention focuses on a connector structure that shortens the ground return path and supports improved transmission performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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