Irvine, CA, United States of America

Xiangnan Pang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Skyworks Global Pte. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiangnan Pang. Retrieved from https://idiyas.com/inventor/xiangnan-pang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Xiangnan Pang

Introduction

Xiangnan Pang is an accomplished inventor based in Irvine, California. He has made significant contributions to the field of electromechanical systems, particularly through his innovative patent work. His expertise and creativity have positioned him as a notable figure in the technology sector.

Latest Patents

Xiangnan Pang holds a patent titled "Embedded Capacitors with Buried Metal Layer Underneath Bulk Acoustic Wave Resonator for Electromechanical Coupling Coefficient Control." This invention focuses on enhancing the performance of electromechanical devices by improving the coupling coefficient, which is crucial for the efficiency of various applications.

Career Highlights

Currently, Xiangnan Pang is employed at Skyworks Global Pte. Ltd., where he continues to develop cutting-edge technologies. His work at Skyworks has allowed him to collaborate with other experts in the field, further advancing his research and innovations.

Collaborations

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Conclusion

Xiangnan Pang's contributions to the field of electromechanical systems through his patent and work at Skyworks Global Pte. Ltd. highlight his role as an influential inventor. His innovative spirit continues to drive advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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