This inventor holds 1 USPTO granted patent, plus 5 CIPO patents and 1 EPO patent. Top assignee: Other. Active years: 2020.
Company Filing History:
1 out of 834,411 Years Active: 2020
Title: Innovations of Xiang Yang Liu in Conductive Materials
Introduction
Xiang Yang Liu is an accomplished inventor based in Nepean, Canada. He is known for his significant contributions to the field of conductive materials, particularly through his innovative patent related to copper ink.
Latest Patents
Xiang Yang Liu holds a patent for "Copper ink and conductive solderable copper traces produced therefrom." This invention involves an ink that contains a mixture of copper nanoparticles, a copper precursor molecule, and a polymeric binder. The polymeric binder is designed to be compatible with diols, enhancing the ink's performance. The resulting conductive traces are not only solderable but also exhibit superior mechanical strength compared to traditional copper inks.
Career Highlights
Throughout his career, Xiang Yang Liu has worked with notable organizations, including the National Research Council of Canada. His work has focused on advancing the technology behind conductive materials, which has applications in various electronic devices.
Collaborations
Xiang has collaborated with talented individuals such as Chantal Paquet and Patrick Malenfant, contributing to the development of innovative solutions in his field.
Conclusion
Xiang Yang Liu's work in developing conductive copper inks represents a significant advancement in material science. His innovative approach continues to influence the industry and pave the way for future developments in conductive materials.