Xian Qin

Title: Innovations of Xian Qin in Stress-Relieving Interconnect Structures

Introduction

Xian Qin is an accomplished inventor based in Atlanta, GA. He has made significant contributions to the field of electronic engineering, particularly in the development of interconnect structures that address thermal expansion challenges.

Latest Patents

Xian Qin holds a patent for "Stress relieving second level interconnect structures and methods of making the same." This innovative patent provides a low-cost solution that accommodates thermal coefficient of expansion (TCE) mismatch between low-TCE packages and printed circuit boards (PCBs). The interconnect structure comprises at least a first pad, a supporting pillar, and a solder bump. The design allows the first pad and supporting pillar to absorb substantially all plastic strain, thereby enhancing compliance between the two electronic components.

Career Highlights

Xian Qin is associated with the Georgia Tech Research Corporation, where he continues to advance his research and development efforts. His work focuses on creating solutions that improve the reliability and performance of electronic devices.

Collaborations

Xian has collaborated with notable colleagues, including Pulugurtha Markondeya Raj and Nitesh Kumbhat, contributing to a dynamic research environment that fosters innovation.

Conclusion

Xian Qin's contributions to stress-relieving interconnect structures exemplify his commitment to addressing critical challenges in electronic engineering. His innovative solutions continue to impact the industry positively.