This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Woon-byung Kang: Innovator in Wafer-Level Chip-Scale Packaging
Introduction
Woon-byung Kang is a notable inventor based in Hwaseong, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and methods.
Latest Patents
Woon-byung Kang holds a patent for a wafer-level-chip-scale package and method of fabrication. This invention includes a semiconductor substrate that comprises an integrated circuit, a conductive ball that is electrically connected to the integrated circuit, and a protective portion made from an insulating material that covers the bottom and side surfaces of the semiconductor substrate.
Career Highlights
Kang is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology in semiconductor packaging. His work has been instrumental in advancing the efficiency and reliability of electronic devices.
Collaborations
He has collaborated with esteemed colleagues such as Yong-hwan Kwon and Chung-Sun Lee, contributing to various projects that enhance the capabilities of semiconductor technologies.
Conclusion
Woon-byung Kang's innovative work in wafer-level chip-scale packaging exemplifies the advancements in semiconductor technology. His contributions are vital to the ongoing evolution of electronic devices and their applications.