Seoul, South Korea

Woon-Bae Kim

This inventor holds 1 USPTO granted patent and 6 published patent applications and 6 EPO patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Woon-Bae Kim. Retrieved from https://idiyas.com/inventor/woon-bae-kim-5vyy7yfd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Woon-Bae Kim: Innovator in Chip on Film Technology

Introduction

Woon-Bae Kim is a prominent inventor based in Seoul, South Korea. He is known for his innovative contributions to the field of semiconductor packaging. His work has significantly impacted the development of advanced display technologies.

Latest Patents

Woon-Bae Kim holds a patent for a "Chip on Film Package and Display Device Including the Same." This invention features a flexible base film with a chip mounting region, a semiconductor chip, and multiple heat dissipation members. The design enhances the efficiency and performance of display devices.

Career Highlights

Woon-Bae Kim is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role involves research and development in semiconductor technologies, where he applies his expertise to create cutting-edge solutions.

Collaborations

Woon-Bae Kim has collaborated with notable colleagues, including Seung-Tae Hwang and Jae-Choon Kim. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Woon-Bae Kim's contributions to semiconductor technology and his innovative patent demonstrate his commitment to advancing the field. His work continues to influence the development of modern display devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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