This inventor holds 1 USPTO granted patent. Top assignee: Samsung Aerospace Industries, Ltd.. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Wook-yeol Ryu: Innovator in Semiconductor Packaging
Introduction
Wook-yeol Ryu is a notable inventor based in Yongin, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods.
Latest Patents
Wook-yeol Ryu holds a patent for a "Method for manufacturing semiconductor package containing cylindrical type bump grid array." This patent outlines a comprehensive process that includes forming bumps on a metal frame, coating them with liquid solder, aligning the frame with a semiconductor substrate, soldering the bumps, and finally separating the bumps from the frame.
Career Highlights
Wook-yeol Ryu is currently employed at Samsung Aerospace Industries, Ltd. His work at this prestigious company has allowed him to develop and refine his innovative techniques in semiconductor packaging.
Collaborations
Some of his notable coworkers include Young-rae Cho and Sang-kyun Lee, who have likely contributed to the collaborative environment that fosters innovation at Samsung Aerospace Industries.
Conclusion
Wook-yeol Ryu's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation in the field. His patent reflects a significant advancement in manufacturing techniques, showcasing his role as a key inventor in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile