Bucheon, South Korea

Woo-Seok Oh

This inventor holds 2 USPTO granted patents and 3 EPO patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2016-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Woo-Seok Oh. Retrieved from https://idiyas.com/inventor/woo-seok-oh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2019

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2 patents (USPTO):Explore Patents

Title: Woo-Seok Oh: Innovator in Packaging Solutions

Introduction

Woo-Seok Oh is a notable inventor based in Bucheon, South Korea. He has made significant contributions to the field of packaging, particularly through his innovative designs. With a total of 2 patents, his work reflects a commitment to enhancing packaging functionality and efficiency.

Latest Patents

One of Woo-Seok Oh's latest patents is a unique corrugated packaging box. This packaging box is formed of corrugated cardboard, wherein the end portions of the box are protruded relative to the middle portion, creating a curved shape. The corrugation direction of the cardboard is parallel to the longitudinal direction of the box, which adds to its structural integrity and aesthetic appeal.

Career Highlights

Throughout his career, Woo-Seok Oh has worked with prominent companies such as Samsung Electronics and Doosan Infracore. His experience in these leading organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Woo-Seok Oh has collaborated with talented individuals in his field, including Ji-won Lee and Bong-Sup Lim. These partnerships have fostered a creative environment that encourages the development of groundbreaking ideas.

Conclusion

In summary, Woo-Seok Oh is a distinguished inventor whose work in packaging solutions has garnered attention and respect in the industry. His innovative designs and collaborations continue to influence the field of packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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