Asan, South Korea

Wonkyoung Choi

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wonkyoung Choi. Retrieved from https://idiyas.com/inventor/wonkyoung-choi-cftleomb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Wonkyoung Choi

Introduction

Wonkyoung Choi is a prominent inventor based in Asan-si, South Korea. He is known for his contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package design.

Latest Patents

Wonkyoung Choi holds a patent for a semiconductor package with a stepped redistribution structure that exposes a mold layer. This semiconductor package includes a first semiconductor device on a first redistribution substrate, a first mold layer that covers the first semiconductor device and the first redistribution substrate, and a second redistribution substrate on the first mold layer. The second redistribution substrate features a first opening that exposes the top surface of the first mold layer, with a sidewall that has a stepwise structure.

Career Highlights

Choi is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has significantly impacted the efficiency and design of semiconductor packages.

Collaborations

He has collaborated with notable colleagues, including Inhyung Song and Kyoung Lim Suk, contributing to various projects within the company.

Conclusion

Wonkyoung Choi's innovative approach to semiconductor packaging exemplifies the advancements being made in technology today. His contributions are paving the way for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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