This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wonjung Jang: Semiconductor Device Innovation
Introduction
Wonjung Jang is an inventor associated with Suwon, South Korea, and Samsung Electronics Co., Ltd. His patent work concerns semiconductor device design and fabrication.
Latest Patents
The provided information lists one patent for Jang: “Semiconductor Device and Method of Fabricating the Same.” The invention describes a semiconductor chip with a pad, a protective layer that exposes part of the pad through an opening, and an electrically connected bump structure. The bump structure includes a metal layer on the pad and a solder ball on the metal layer. The metal layer’s width is specified as approximately 0.85 to 0.95 times the width of the opening. Jang is credited with 1 patent.
Career Highlights
Jang’s listed patent reflects work on semiconductor packaging and fabrication, particularly the structure connecting a chip pad to a solder ball. The provided information associates him with Samsung Electronics Co., Ltd.
Collaborations
Sangho Cha is identified as Jang’s coworker. The information provided does not specify whether Cha collaborated on the patent.
Conclusion
Wonjung Jang’s listed invention addresses the design and fabrication of a semiconductor bump structure, contributing to the broader field of semiconductor device technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile