Daejeon, South Korea

Won-Il Son

This inventor holds 1 USPTO granted patent. Top assignee: Enjet Co. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Won-Il Son. Retrieved from https://idiyas.com/inventor/won-il-son-aebgj2wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Won-Il Son in 3D Surface Printing

Introduction

Won-Il Son is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of 3D printing technology. His innovative approach focuses on enhancing the capabilities of surface printing, particularly in the edge areas of substrates.

Latest Patents

Won-Il Son holds a patent for a "3D surface printing apparatus for the edge area of substrate." This apparatus includes a jig part that erects and immobilizes the substrate. It features a nozzle part that ejects ink through Electrohydrodynamic (EHD) jetting by applying a voltage to an electrode. The moving part of the apparatus allows the nozzle to move left and right, enabling the printing of a pattern that is continuously connected along the front surface, side surface, and rear surface of the substrate's rim. The control part of the apparatus manages the printing operation, taking into account changes in the 3D electric field distribution.

Career Highlights

Won-Il Son is associated with Enjet Co. Ltd., where he continues to develop and refine his innovative technologies. His work has positioned him as a key figure in the advancement of 3D printing applications.

Collaborations

He collaborates with talented coworkers, including Do Young Byun and Baek Hoon Seong, who contribute to the innovative projects at Enjet Co. Ltd.

Conclusion

Won-Il Son's contributions to 3D surface printing technology demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement in printing techniques, showcasing the potential for future developments in substrate applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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