Jecheon, South Korea

Won-gi Chang

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Won-gi Chang. Retrieved from https://idiyas.com/inventor/won-gi-chang-j9fegort

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovations of Won-gi Chang

Introduction

Won-gi Chang is a notable inventor based in Jecheon, South Korea. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the performance and efficiency of semiconductor packages.

Latest Patents

Won-gi Chang holds a patent for a semiconductor package substrate and semiconductor package having the same. This invention includes a package substrate with a defined boundary and a first semiconductor chip that is strategically placed to optimize its functionality. The design allows for a second semiconductor chip to be integrated, enhancing the overall performance of the package.

Career Highlights

Chang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves research and development in semiconductor technologies, where he applies his expertise to create cutting-edge products. His innovative approach has contributed to the advancement of semiconductor packaging solutions.

Collaborations

Chang has collaborated with his coworker, Tae-sung Park, on various projects within Samsung Electronics. Their teamwork has fostered an environment of innovation and creativity, leading to the successful development of new technologies.

Conclusion

Won-gi Chang's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at Samsung Electronics highlight the importance of advancements in this field. His efforts continue to shape the future of semiconductor packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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