Wolfgang K Saur

Title: **The Innovations of Wolfgang K. Saur**

Introduction

Wolfgang K. Saur, a notable inventor based in Mannedorf, Switzerland, has made significant strides in the field of materials science and engineering. With a total of seven patents to his name, he has contributed to the development of advanced bonding methods and substrate technologies that enhance the performance of electronic components.

Latest Patents

Among his latest innovations is a patent for a silicon or silica substrate with a modified surface. This innovation aims to improve the performance characteristics of various electronic applications. Furthermore, Saur has developed a method for bonding polyimide films and printed circuit boards using an adhesive that contains a thermically curable oxazene resin. This adhesive, featuring at least one 1-oxa-3-aza tetraline group, provides exceptional heat resistance and peeling resistance, making it particularly effective in manufacturing printed circuit boards that require high thermal stability.

Career Highlights

Throughout his career, Wolfgang K. Saur has held key positions in leading companies, such as Gurit-Essex AG and Owens Corning Fiberglas Technology, Inc. His work has been instrumental in advancing technologies related to composite materials and electronic bonding.

Collaborations

Saur has collaborated with several distinguished professionals in his field, including Herbert Schreiber and Robert Tonolla. These partnerships have fostered innovation and have been crucial in driving forward the enhancement of bonding technologies.

Conclusion

Wolfgang K. Saur's contributions to innovation in bonding methods and material substrates have paved the way for advancements in electronic manufacturing. His extensive patent portfolio reflects his commitment to pushing the boundaries of technology, making significant impacts in the fields of materials science and engineering.