Company Filing History:
Years Active: 1996
Title: Wolfgang Hempel: Innovator in Electroplating Technology
Introduction
Wolfgang Hempel is a notable inventor based in Friedberg, Germany. He has made significant contributions to the field of electroplating, particularly in the development of silver-tin alloys. His innovative work has led to advancements in the manufacturing processes that utilize these materials.
Latest Patents
Hempel holds a patent for an "Electroplating bath for the electrodeposition of silver-tin alloys." This patent describes a method for depositing silver-tin alloys using a cyanide-free bath. The bath is prepared with silver in the form of a nitrate or diammine complex and tin as a soluble tin(II) or tin(IV) compound. The process allows for the deposition of uniform and adhering coatings of silver-tin alloys, with a silver content ranging from approximately 20 to 99 weight percent. The electrodeposition occurs at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm².
Career Highlights
Hempel is associated with W.C. Heraeus GmbH, a company known for its expertise in precious metals and materials technology. His work at the company has been instrumental in advancing electroplating techniques and applications.
Collaborations
Throughout his career, Wolfgang Hempel has collaborated with notable colleagues, including Gunter Herklotz and Thomas Frey. These collaborations have contributed to the development of innovative solutions in the field of electroplating.
Conclusion
Wolfgang Hempel's contributions to the field of electroplating, particularly through his patent on silver-tin alloys, highlight his role as an innovator in materials technology. His work continues to influence the industry and pave the way for future advancements.