Company Filing History:
Years Active: 1992-1993
Title: Innovations of Wolfgang H. Herr
Introduction
Wolfgang H. Herr is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, his work has had a considerable impact on the industry.
Latest Patents
One of Wolfgang H. Herr's latest patents is an "Adapter and test fixture for an integrated circuit device package." This invention features a test fixture designed for high pin count surface-mounted IC devices. The test head assembly is connected to an adapter that includes electrically conductive elements. These elements couple the output of the IC device to test points on the test head assembly. The test points are linked to conductive pads on the test head assembly through conductive runs. The conductive pads on the test head assembly mate with conductive pads formed in the adapter's electrically conductive elements. The conductive elements engage leads on the IC device, providing conductive paths between the IC leads and the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. Additionally, the test fixture or adapter can be used as a low-profile chip carrier by inverting it, as well as serving as a circuit board interconnect.
Career Highlights
Wolfgang H. Herr is currently employed at Tektronix, Inc., where he continues to innovate in the field of electronics. His work has been instrumental in advancing testing technologies for integrated circuits.
Collaborations
Wolfgang has collaborated with several talented individuals, including Paul A. Cole and Bozidar Janko. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Wolfgang H. Herr's contributions to integrated circuit technology through his patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future innovations.