Company Filing History:
Years Active: 1989-1993
Title: Innovations by Wolfgang Euen: A Pioneer in Dielectric Layer Technology
Introduction: Wolfgang Euen, an accomplished inventor based in Böblingen, Germany, has made significant contributions to the field of semiconductor technology through his innovative patents. With a total of three patents to his name, Euen's work primarily focuses on methods for forming thin dielectric layers, which are integral to the performance and reliability of electronic devices.
Latest Patents: Wolfgang Euen's latest patent details a groundbreaking method for forming a thin dielectric layer on a substrate. This invention discloses the creation of a thin inorganic dielectric layer that is approximately 20 nm thick, characterized by a defect density of no more than 0.6 defects/cm² as determined by BV measurements. The methodology involves forming a layer with the desired composition and thickness on a substrate, followed by ion implantation through the layer at a dose of no less than 10^15 ions/cm². This process is concluded with an annealing step at temperatures exceeding 500°C for a specified duration. The repeated emphasis on the thin dielectric layer showcases the significance of Euen's inventions in enhancing electronic components.
Career Highlights: Wolfgang Euen is currently employed by the International Business Machines Corporation (IBM), a leading company at the forefront of technological advancements. His role there has allowed him to collaborate on various innovative projects, reinforcing his career as a prominent figure in the technological community.
Collaborations: Throughout his career, Euen has collaborated with notable colleagues such as Dieter Hagmann and Hans-Jurgen Wildau, contributing collectively to advancements in semiconductor technology. These partnerships have fostered a collaborative environment that enhances the quality and effectiveness of their inventions.
Conclusion: Wolfgang Euen's contributions to the field of semiconductor technology through his patented methods for forming thin dielectric layers have positioned him as a key innovator in his field. His ongoing work at IBM and collaborations with fellow inventors continue to push the boundaries of what is possible in electronics, highlighting the importance of innovation in driving the industry forward.