Diespeck, Germany

Wolfgang Esch

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Aktiengesellschaft. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wolfgang Esch. Retrieved from https://idiyas.com/inventor/wolfgang-esch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Innovations by Wolfgang Esch

Introduction

Wolfgang Esch is a notable inventor based in Diespeck, Germany. He has made significant contributions to the field of technology, particularly in the area of installation and testing instructions. His work is recognized for its practical applications and innovative approach.

Latest Patents

Wolfgang Esch holds a patent for a "Device and method for handling installation and testing instructions." This invention relates to a device and method for creating, providing, and documenting assembly and test instructions. His innovative approach enhances the efficiency and clarity of installation processes.

Career Highlights

Esch is currently employed at Siemens Aktiengesellschaft, a leading global technology company. His role at Siemens allows him to collaborate with other talented professionals and contribute to cutting-edge projects. His expertise in developing practical solutions has been instrumental in advancing the company's technological capabilities.

Collaborations

Wolfgang has worked alongside notable colleagues such as Harald Bär and Günther Domauer. Their collaborative efforts have fostered an environment of innovation and creativity within their projects.

Conclusion

Wolfgang Esch's contributions to the field of technology through his patent and work at Siemens Aktiengesellschaft highlight his role as a significant inventor. His innovative solutions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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