Wolfgang Bergner

Title: Wolfgang Bergner: Innovator in Semiconductor Technology

Introduction

Wolfgang Bergner is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work has had a lasting impact on the industry.

Latest Patents

Bergner's latest patents include a method for forming a self-aligned buried plate in a silicon substrate. This method involves etching a deep trench into the silicon substrate and forming a highly doped polysilicon layer within the trench. A nitride layer is then created over the polysilicon layer, followed by an etching process that exposes the silicon substrate at the uppermost portions of the sidewalls. This process is crucial for protecting the edges of the polysilicon layer. Another significant patent focuses on improving the controllability of buried device layers, which reduces variations across the chip. This enhancement leads to better performance of integrated circuits by defining both the top and lower surfaces of the buried layer.

Career Highlights

Throughout his career, Wolfgang Bergner has worked with prominent companies such as Siemens Aktiengesellschaft and IBM. His experience in these leading organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Bergner has collaborated with notable colleagues, including Juergen Wittmann and Johann Alsmeier. These partnerships have fostered an environment of innovation and creativity, further enhancing the quality of his work.

Conclusion

Wolfgang Bergner's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and inspire future advancements.