Holzgerlingen, Germany

Wolfgang Augstein

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1984.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wolfgang Augstein. Retrieved from https://idiyas.com/inventor/wolfgang-augstein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1984

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Wolfgang Augstein and His Polysilicon Etching Invention

Introduction

Wolfgang Augstein is an inventor associated with Holzgerlingen, Germany, and International Business Machines Corporation. His patent work addresses a method for controlling the edge angles of openings etched in a polysilicon layer.

Latest Patents

Augstein is associated with 1 patent: “Method of Adjusting the Edge Angle in Polysilicon.” The invention describes pretreating a polysilicon layer before forming a photoresist mask. The treatment uses a mixture of five parts water, one to three parts ammonia, and 0.25 to one part hydrogen peroxide. It is advantageously performed at a temperature between 40°C and 70°C, allowing the steepness of the etched opening’s edge angles to be adjusted.

Career Highlights

Augstein’s listed patent is connected with International Business Machines Corporation, commonly known as IBM. It focuses on process control in polysilicon etching, a technique relevant to semiconductor fabrication.

Collaborations

His listed coworkers include Peter U. Frasch and Blanka Ivancic.

Conclusion

Wolfgang Augstein’s patent documents a chemical pretreatment method for adjusting edge angles in etched polysilicon, reflecting his contribution to semiconductor process technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…